Part Number Hot Search : 
UPC1378H PP75T060 908QT1CF T3904 100B6 1100P CKCL22 AT54S
Product Description
Full Text Search
 

To Download BD82000FVJ-LB Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/22 tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 1 channel high side switch ics 1.5a current limit high side switch ics BD82000FVJ-LB bd82001fvj-lb general description this is the product guarantees long time support in industrial market. single channel high side switch ic for usb port is a high side switch having over-c urrent protection used in power supply line of universal serial bus (usb). n-channel power mosfet of low on resistance and low supply current are realized in this ic. and, over-current detection circuit, thermal shutdown circuit, under-voltage lockout and soft start circuit are built in. features ? long time support a product for industrial applications. ? low on-resistance 70m ? mosfet switch ? current limit threshold 1.5a ? control input logic ? active ?low? control logic: bd82000fvj ? active ?high? control logic: bd82001fvj ? soft-start circuit ? over-current protection ? thermal shutdown ? under-voltage lockout ? open-drain error flag output ? ttl enable input ? 0.8ms typical rise time applications industrial equipment, pc, pc peripheral equipment, usb hub in consumer appliances, car accessory, and so forth key specifications ? input voltage range: 2.7v to 5.5v ? on resistance : 70m ? (typ.) ? over current threshold: 1.0a min., 2.0a max. ? number of channels: 1ch ? standby current: 0.01 a (typ.) ? operating temperature range: -40 to +85 package w(typ.) d(typ.) h (max.) sop-j8 3.00mm x 4.90mm x 1.10mm typical application circuit lineup over current detection control input logic package orderable part number min. typ. max. 1.0a 1.5a 2.0a low tssop-b8 j reel of 2500 BD82000FVJ-LBe2 1.0a 1.5a 2.0a high tssop-b8 j reel of 2500 bd82001fvj-lbe2 tssop-b8j out out out in in /oc gnd vbus d- d+ gnd 5v(typ.) c l c in - + en(/en)
2/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 block diagram uvlo in gnd charge pump gate logic ocd tsd in en /en out out out /oc pin configurations 1 2 3 4 8 7 6 5 out out out /oc gnd in in /en 1 2 3 4 8 7 6 5 out out out / oc gnd in in en pin description pin no. symbol i / o pin function 1 gnd - ground. 2, 3 in - power supply input. input terminal to the power switch and power s upply input terminal of the internal circuit. at use, connect each pin outside. 4 en , /en i enable input. power switch on at low level.(bd82000fvj) power switch on at high level.(bd82001fvj) high level input > 2.0v, low level input < 0.8v. 5 /oc o error flag output. low at over-current, thermal shutdown. open drain output. 6, 7, 8 out o power switch output. at use, connect each pin outside. bd82000fvj (top view) bd82001fvj (top view)
3/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 absolute maximum ratings (ta=25 ) parameter symbol ratings unit supply voltage v in -0.3 to 6.0 v enable input voltage v en -0.3 to 6.0 v /oc voltage v /oc -0.3 to 6.0 v /oc sink current is /oc below 5 ma out voltage v out -0.3 to 6.0 v storage temperature t stg -55 to 150 power dissipation pd 587.5 *1 mw *1 mounted on 70mm*70mm*1.6mm glass-epoxy pcb. derating : 4.7mw/ above ta=25 . recommended operating ratings parameter symbol ratings unit min. typ. max. operating voltage v in 2.7 - 5.5 v operating temperature t opr -40 - 85 electrical characteristics bd82000fvj (unless otherwise specified v in = 5.0v, ta = 25 ) parameter symbol limits unit condition min. typ. max. operating current i dd - 110 160 a v /en = 0v , out=open standby current i stb - 0.01 1 a v /en = 5v , out=open /en input voltage v /en 2.0 - - v high input v /en - - 0.8 v low input /en input current i /en -1.0 0.01 1.0 a v /en = 0v or v /en = 5v /oc output low voltage v /ocl - - 0.5 v i /oc = 0.5ma /oc output leak current il /oc - 0.01 1 a v /oc = 5v /oc delay time t /oc 10 15 20 ms on-resistance r on - 70 110 m ? i out = 500ma switch leak current il sw - - 1.0 a v /en = 5v, v out = 0v current limit threshold i th 1.0 1.5 2.0 a short circuit current i sc 0.7 1.0 1.4 a v out = 0v c l = 47 f (rms) output rise time t on1 - 0.8 10 ms r l = 10 ? output turn-on time t on2 - 1.1 20 ms r l = 10 ? output fall time t off1 - 5 20 s r l = 10 ? output turn-off time t off2 - 10 40 s r l = 10 ? uvlo threshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in
4/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 electrical characteristics - continued bd82001fvj (unless otherwise specified v in = 5.0v, ta = 25 ) parameter symbol limits unit condition min. typ. max. operating current i dd - 110 160 a v en = 5v , out=open standby current i stb - 0.01 1 a v en = 0v , out=open en input voltage v en 2.0 - - v high input v en - - 0.8 v low input en input current i en -1.0 0.01 1.0 a v en = 0v or v en = 5v /oc output low voltage v /ocl - - 0.5 v i /oc = 0.5ma /oc output leak current il /oc - 0.01 1 a v /oc = 5v /oc delay time t /oc 10 15 20 ms on-resistance r on - 70 110 m ? i out = 500ma switch leak current il sw - - 1.0 a v en = 0v, v out = 0v current limit threshold i th 1.0 1.5 2.0 a short circuit current i sc 0.7 1.0 1.4 a v out = 0v c l = 47 f (rms) output rise time t on1 - 0.8 10 ms r l = 10 ? output turn-on time t on2 - 1.1 20 ms r l = 10 ? output fall time t off1 - 5 20 s r l = 10 ? output turn-off time t off2 - 10 40 s r l = 10 ? uvlo threshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvhl 2.0 2.2 2.4 v decreasing v in
5/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 measurement circuit gnd in in en(/en) out out out /oc v en (v /en ) 1f v in a gnd in in en(/en) out out out / oc v en (v /en ) 1f r l c l v in 10k ? v in a a. operating current inrush current b. en , /en input voltage, output rise, fall time gnd in in en(/en) out out out / oc v en (v /en ) 1f 10k ? c l v in v in i ou t a gnd in in en(/en) out out out /oc v en (v /en ) 1f v in v in i /oc c. on-resistance over-current de tection d. /oc output low voltage figure 1. measurement circuit timing diagram t on1 v out 10% 90% 90% t off1 t on2 v /en 50% t off2 50% t on1 v out 10% 90% 90% t off1 t on2 v en 50% t off2 50% figure 2. timing diagram (bd82000fvj) figure 3. timing diagram (bd82001fvj)
6/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) figure 6. standby current en,/en disable figure 4. operating current en,/en enable figure 5. operating current en,/en enable figure 7. standby current en,/en disable 0 20 40 60 80 100 120 140 23456 supply voltage : vin[v] operating current : i dd[ a] ta=25c 0 20 40 60 80 100 120 140 -50 0 50 100 ambient temperature : ta[] operating current : i dd[ a] v in =5.0v 0.0 0.2 0.4 0.6 0.8 1.0 23456 supply voltage : vin[v] standby current : i stb [ a] ta=25c 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby current : i stb[ a] v in =5.0v
7/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued figure 8. en,/en input voltage figure 10. on-resistance figure 11. on-resistance 0.0 0.5 1.0 1.5 2.0 23456 supply voltage : vin[v] enable input voltage : v en [v] 0 low to high high to low ta=25 0 50 100 150 200 23456 su p p l y vo l ta g e : vin [v] on resistance : r on [m ? ] ta=25c 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[] on resistance : r on [m ? ] v in =5.0v figure 9. en,/en input voltage 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[ ] enable input voltage : v [v] vin=5.0v high to low low to high
8/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued figure 12. current limit threshold figure 13. current limit threshold figure 14. short circuit current figure 15. short circuit current 1.0 1.2 1.4 1.6 1.8 2.0 23456 supply voltage : vin[v] current limit threshold : i th [a] ta=25c 1.0 1.2 1.4 1.6 1.8 2.0 -50 0 50 100 am bient tem perature : ta[] current limit threshold : i th [a] v in =5.0v 0.4 0.6 0.8 1.0 1.2 1.4 23456 supply voltage : v in [v] short-circuit current : i [a] ta=25c 0.4 0.6 0.8 1.0 1.2 1.4 -50 0 50 100 ambient temperature : ta[ ] short-circuit current : i sc [a] v in =5.0v
9/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued figure 16. /oc output low voltage figure 17. /oc output low voltage figure 18. uvlo threshold voltage figure 19. uvlo hysteresis voltage 0.0 0.2 0.4 0.6 0.8 1.0 -50050100 ambient temperature : ta[ ] uvlo hysteresis voltage : v 0 20 40 60 80 100 23456 supply voltage : vin[v] /oc output low voltage : v /oc [mv] ta=25c 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[] /oc output low voltage :v /oc[mv] v in =5.0v 2.0 2.1 2.2 2.3 2.4 2.5 -50050100 ambient temperature : ta[ ] uvlo threshold : v tuvh,vtuvl[v ] v tuvh v t u vl
10/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued figure 22. output turn-on time figure 23. output turn-on time figure 20. output rise time figure 21. output rise time 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : vin[v] rise time : ton1[ms] ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[] rise time : ton1[ms] v in =5.0v 0.0 1.0 2.0 3.0 4.0 5.0 23456 su p p l y vo l ta g e : vin [v] turn on time : ton2[ms] ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[] turn on time : ton2[ms] v in =5.0v
11/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued ta = 2 5 c 0 2 4 6 8 10 23456 supply voltage : vin[v] turn off time : toff2[ s] figure 26. output turn-off time figure 24. output fall time figure 25. output fall time figure 27. output turn-off time 0 2 4 6 8 10 -50 0 50 100 ambient temperature : ta[ ] turn off time : toff2[ s] 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage: vin[v] fall time : toff1[ s] ta=25c ta=25c v in =5.0v
12/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued 10 12 14 16 18 20 -50 0 50 100 ambient temperature : ta[ ] /oc delay time : t /oc [ms] figure 28. /oc delay time figure 29. /oc delay time 10 12 14 16 18 20 23456 supply voltage : vin[v] /oc delay time : t /oc[ms] ta=25c v in =5.0v
13/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical wave forms (bd82001fvj) v en (5v/div.) v in =5v r l =10 ? c l =100 f v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) time (1ms/div.) figure 30. output rise characteristic v en (5v/div.) v in =5v r l =10 ? c l =100 f v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) time (1ms/div.) figure 31. output rise characteristic v en (5v/div.) v in =5v r l =10 ? v /oc (5v/div.) i in (0.5a/div.) c l =47f c l =100f c l =147f time (1ms/div.) figure 32. inrush current response v out (5v/div.) v /oc (5v/div.) i out (0.5a/div.) v in =5v c l =100 f time (10ms/div.) figure 33. over-current response ramped load
14/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical wave forms - continued v out (5v/div.) v in =5v c l =100 f v /oc (5v/div.) i out ( 0.5a/div. ) time (2ms/div.) figure 34. over-current response ramped load v en (5v/div.) v in = 5v c l =100 f v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) time (5ms/div.) figure 35. over-current response enable to shortcircuit time (5ms/div.) figure 36. over-current response 1 load connected at enable v /oc (5v/div.) v out (5v/div.) i out (1.0a/div.) v in =5v c l =100 f time (200ms/div.) figure 37. thermal shutdown 1 load connected at enable v in =5v c l =100 f v /oc (5v/div.) v out (5v/div.) thermal shutdown i out (1.0a/div.)
15/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical wave forms - continued v in (5v/div.) r l =10 ? c l =100 f v out (5v/div.) v /oc (5v/div.) i out (0.5a/div.) time (10ms/div.) figure 38. uvlo response increasing v in v in (5v/div.) r l =10 ? c l =100 f v out (5v/div.) v /oc ( 5v/div. ) i out (0.5a/div.) time (10ms/div.) figure 39. uvlo response decreasing v in
16/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical application circuit in out regulator out out out in in /oc gnd vbus d- d+ gnd usb controller 5v(typ.) 10k to 100k ? c l c in - + en ( / en ) application information when excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to ic, and may cause bad influences upon ic actions. in order to avoid this case, connect a bypath capacitor by in terminal and gnd terminal of ic. 1 f or higher is recommended. pull up /oc output by resistance 10k ? to 100k ?. set up value which satisfies the application as c l . this system connection diagram doesn?t guar antee operating as the application. the external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account external parts or dispersion of ic including not only stat ic characteristics but also transient characteristics. functional descriptions 1. switch operation in terminal and out terminal are connected to the drain and the source of switch mosfet respectively. and the in terminal is used also as power source input to internal control circuit. when the switch is turned on from en, /en control input, in terminal and out terminal are connected by a 70m ? switch. in on status, the switch is bidirectional. therefore, when t he potential of out terminal is hi gher than that of in terminal, current flows from out te rminal to in terminal. 2. thermal shutdown circuit (tsd) if over-current would continue, the temper ature of the ic would increase drasti cally. if the junction temperature were beyond 170c (typ.) in the condition of over-current detection, thermal shut down circuit operates and makes power switch turn off and outputs error flag (/oc). then, when t he junction temperature decreases lower than 150c (typ.), power switch is turned on and error flag (/oc) is cancelled. unless the fact of the incr easing chips temperature is removed or the output of power switch is turned off, this operation repeats. the thermal shutdown circuit operates when the switch is on (en, /en signal is active). 3. over-current detection (ocd) the over-current detection circuit limits current (i sc ) and outputs error flag (/oc) when current flowing in each switch mosfet exceeds a specified value. there are three types of response against over-current. the over-current detection circuit works when the switch is on (en, /en signal is active).
17/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 3-1. when the switch is turned on while the output is in shortcircuit status when the switch is turned on while the out put is in shortcircuit status or so, the switch gets in current limit status soon. 3-2. when the output shortcircu its while the switch is on when the output shortcircuits or large capacity is connected while the switch is on, very large current flows until the over-current limit circuit reacts. when the current detecti on, limit circuit works, current limitation is carried out. 3-3. when the output curre nt increases gradually when the output current increases gradually, current limitat ion does not work until the output current exceeds the over-current detection value. when it exceeds the detection value, current limitation is carried out. 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v (typ.). if the v in drops below 2.2v (typ.) while the switch turns on, then uvlo shuts off the power switch. uvlo has hysteresis of a 100mv (typ.). under-voltage lockout circuit works when the switch is on (en, /en signal is active). 5. error flag (/oc) output error flag output is n-mos open drain output. at detection of over-current, thermal shutdown, low level is output. over-current detection has delay filter. th is delay filter prevents instantaneous cu rrent detection such as inrush current at switch on, hot plug from being informed to outside. v /en v out i out v /oc output shortcircuit thermal shut down delay figure 40. over-current detection, thermal shutdown timing (bd82000fvj) v en v out i out v /oc output shortcircuit thermal shut down delay figure 41. over-current detection, thermal shutdown timing (bd82001fvj)
18/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 power dissipation (tssop-b8j) 0 100 200 300 400 500 600 0 25 50 75 100 125 150 ambient temperature: ta [ ] power dissipation: pd[mw] figure 42. power dissipation curve (pd-ta curve) i/o equivalence circuit symbol pin no equivalence circuit en(/en) 4 /oc 5 out 6,7,8
19/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assum ed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteri stics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protective measures against the breakdown due to the reverse connection, such as mounti ng an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines. in this regard, for the digital block power supply and the analog block powe r supply, even though these po wer supplies has the same level of potential, separate the power supply pattern for the di gital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to b e used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient . (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then di smount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. (9) input terminals in terms of the construction of ic, para sitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applie d to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluc tuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant wi th consideration given to a degradation in the nominal capacitance due to dc bias and c han ges in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) when junction temperatures become detecte d temperatures or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit is aimed at isolati ng the lsi from thermal runaway as much as possible. do not continuously use the lsi with this circuit ope rating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the power dissipation (pd) in actual states of use.
20/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 ordering information b d 8 2 0 0 0 f v j - l b e 2 part number package fvj : tssop-b8j product class lb for industrial applications packaging and forming specification e2: embossed tape and reel b d 8 2 0 0 1 f v j - l b e 2 part number package fvj : tssop-b8j product class lb for industrial applications packaging and forming specification e2: embossed tape and reel marking diagram part number part number marking bd82000fvj d82000 bd82001fvj d82001 tssop-b8j(top view) part number marking lot numbe r 1pin mark
21/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 physical dimension tape and reel information package name tssop-b8j direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () 1pin
22/22 BD82000FVJ-LB bd82001fvj-lb datasheet tsz02201-0e3e0h300430-1-2 21.feb.2014 rev.002 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 revision history date revision changes 13.mar.2013 001 new release 21.feb.2014 002 delete sentence ?and log life cycle? in general description and futures (page 1). change ?industrial applications? to ?industr ial equipment? in applications (page 1). applied new style (?title? and ?ordering information?).
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD82000FVJ-LB package tssop-b8j unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BD82000FVJ-LB - web page distribution inventory


▲Up To Search▲   

 
Price & Availability of BD82000FVJ-LB

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X